Medical Engineering & Physics
Volume 32, Issue 7 , Pages 690-699, September 2010

Welding methods for joining thermoplastic polymers for the hermetic enclosure of medical devices

  • Negin Amanat

      Affiliations

    • School of Physics, University of Sydney, NSW, Australia
    • Cochlear Ltd, Lane Cove, NSW, Australia
  • ,
  • Natalie L. James

      Affiliations

    • Cochlear Ltd, Lane Cove, NSW, Australia
  • ,
  • David R. McKenzie

      Affiliations

    • Applied and Plasma Physics, School of Physics, University of Sydney, Building A28, NSW 2006, Australia
    • Corresponding Author InformationCorresponding author. Tel.: +61 2 9351 3577; fax: +61 2 9351 7726.

Received 2 October 2009; received in revised form 18 February 2010; accepted 12 April 2010. published online 07 June 2010.

Abstract 

New high performance polymers have been developed that challenge traditional encapsulation materials for permanent active medical implants. The gold standard for hermetic encapsulation for implants is a titanium enclosure which is sealed using laser welding. Polymers may be an alternative encapsulation material. Although many polymers are biocompatible, and permeability of polymers may be reduced to acceptable levels, the ability to create a hermetic join with an extended life remains the barrier to widespread acceptance of polymers for this application. This article provides an overview of the current techniques used for direct bonding of polymers, with a focus on thermoplastics. Thermal bonding methods are feasible, but some take too long and/or require two stage processing. Some methods are not suitable because of excessive heat load which may be delivered to sensitive components within the capsule. Laser welding is presented as the method of choice; however the establishment of suitable laser process parameters will require significant research.

Keywords: Polymeric encapsulation, Implantable devices, Direct bonding, Joining polymers, Medical device

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PII: S1350-4533(10)00085-8

doi:10.1016/j.medengphy.2010.04.011

Medical Engineering & Physics
Volume 32, Issue 7 , Pages 690-699, September 2010